| |
|
 |
Murata Manufacturing Co Ltd |
| Part No. |
GC355DD7LP684KX18L
|
| Description |
High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Murata Manufacturing Co Ltd |
| Part No. |
GR355DD7LP684KW01L
|
| Description |
High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for General Purpose
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Murata Manufacturing Co Ltd |
| Part No. |
GR355DD7LP684KW01K
|
| Description |
High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for General Purpose
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Murata Manufacturing Co Ltd |
| Part No. |
GC355DD7LP684KX18K
|
| Description |
High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
87916-411HLF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68016-411HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 11 Positions, 2.54 mm (0.100) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
61641-303LF
|
| Description |
<span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 57102</b></span><br><br>Minitek® 2.00mm, Board/Wire to Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, Duplex, Polarized, 26 Position ,2.00mm (0.079in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
87911-6411 0879116411
|
| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 64 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 64 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
| File Size |
360.70K /
6 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68016-415HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
87916-415HLF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10136164-101LF
|
| Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 85Ohm, 6-Pair, 12 column, 240 position, Right Angle Header, No Guide Pin.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
