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  1140-2036 Datasheet PDF File

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    D1140

Toshiba Semiconductor
Part No. D1140
Description Search --To 2SD1140

File Size 224.30K  /  4 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1140-4032

Molex Electronics Ltd.
Part No. 1140-4032
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 67292-036LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 72 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

    MJE371 ON2036

ON Semiconductor
MOTOROLA[Motorola, Inc]
Part No. MJE371 ON2036
Description POWER TRANSISTOR PNP SILICON 4 A, 40 V, PNP, Si, POWER TRANSISTOR, TO-225AA
4 AMPERE POWER TRANSISTOR PNP SILICON 40 VOLTS 40 WATTS
From old datasheet system

File Size 122.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-203600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    1140-4009 0011-40-4009

Molex Electronics Ltd.
Part No. 1140-4009 0011-40-4009
Description Insulation Punch

File Size 14.47K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-203609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    11-40-2076 1140-2076 0011-40-2076

Molex Electronics Ltd.
Part No. 11-40-2076 1140-2076 0011-40-2076
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-820-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    A-70475-1140

Molex Electronics Ltd.
Part No. A-70475-1140
Description
File Size 139.28K  /  2 Page

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Amphenol Communications Solutions

Part No. 75160-120-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs    

Official Product Page

    SAMTEC INC
Part No. MTSW-225-27-S-D-1140 MTSW-240-23-T-D-255
Description 50 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SOLDER
80 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SOLDER

File Size 400.79K  /  2 Page

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Amphenol Communications Solutions

Part No. 61082-203602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    11-40-2066 1140-2066 0011-40-2066

Molex Electronics Ltd.
Part No. 11-40-2066 1140-2066 0011-40-2066
Description Terminator Die - DOUBLES

File Size 19.46K  /  1 Page

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Amphenol Communications Solutions

Part No. 61082-203609LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    11-40-2045 1140-2045 0011-40-2045

Molex Electronics Ltd.
Part No. 11-40-2045 1140-2045 0011-40-2045
Description Terminator Die - OVERLAP INSULATION CRIMP

File Size 19.49K  /  1 Page

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Amphenol Communications Solutions

Part No. UE863G262020361
Description 2X2SFP ULTRAPORT W/H LP
Tech specs    

Official Product Page

    53358-1140

Molex Electronics Ltd.
Part No. 53358-1140
Description 2.00mm (.049) Pitch Mi II Wire-to-Wire Adapter, 11 Circuits, Lead-free

File Size 130.52K  /  2 Page

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Amphenol Communications Solutions

Part No. UE86S442C20361
Description ExpressPort SFP+, High Speed Input Output Connectors, 2X4 SFP COMBO THERMAL.
Tech specs    

Official Product Page

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