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44040 MPX200GP 14001 14300 3R108 DL4749 INLINE SPL10A
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  001118-4175 Datasheet PDF File

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    0011184450

Molex Electronics Ltd.
Part No. 0011184450
Description Insulation Punch

File Size 14.57K  /  1 Page

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Rochester Electronics LLC

Part No. 54175/BEA
Description 54175 - Flip-Flop, D-Type, 4-Bit - Dual marked (M38510/01702BEA)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0011-18-5072 0011185072 1118-5072

Molex Electronics Ltd.
Part No. 0011-18-5072 0011185072 1118-5072
Description Insulation Anvil

File Size 16.14K  /  1 Page

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Amphenol Communications Solutions

Part No. 68001-118HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0011-18-5073 11-18-5073 0011185073

Molex Electronics Ltd.
Part No. 0011-18-5073 11-18-5073 0011185073
Description Conductor Punch

File Size 22.14K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-409241750LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    11-18-5070 0011-18-5070 0011185070 1118-5070

Molex Electronics Ltd.
Part No. 11-18-5070 0011-18-5070 0011185070 1118-5070
Description Conductor Anvil

File Size 11.60K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-809141750LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    11-18-5071 0011-18-5071 0011185071 1118-5071

Molex Electronics Ltd.
Part No. 11-18-5071 0011-18-5071 0011185071 1118-5071
Description Insulation Punch

File Size 14.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-109241750LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0011-18-5074 0011185074 1118-5074

Molex Electronics Ltd.
Part No. 0011-18-5074 0011185074 1118-5074
Description Conductor Anvil

File Size 23.80K  /  1 Page

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Amphenol Communications Solutions

Part No. 77314-175RLF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    0011185331 0011-18-5331

Molex Electronics Ltd.
Part No. 0011185331 0011-18-5331
Description Insulation Anvil

File Size 23.89K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-409141750LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0011185330

Molex Electronics Ltd.
Part No. 0011185330
Description Insulation Punch

File Size 22.15K  /  1 Page

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Amphenol Communications Solutions

Part No. 89074-175LF
Description Metral® Board Connectors, Backplane Connectors 4 Row Signal Header, Straight, 2 Mod, Press Fit.
Tech specs    

Official Product Page

    0011185438

Molex Electronics Ltd.
Part No. 0011185438
Description Insulation Punch

File Size 14.57K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-809041750LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0011185106 1118-5106 11-18-5106 001118-5106 0011-18-5106

Molex Electronics Ltd.
Part No. 0011185106 1118-5106 11-18-5106 001118-5106 0011-18-5106
Description Conductor Punch

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 10080054-175LF
Description Quickie Header, Wire to Board Connector, Double Row, 40 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs    

Official Product Page

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