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NXP Semiconductors N.V.
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| Part No. |
PSMN3R7-30YLC
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| Description |
N-channel 30 V 3.95m logic level MOSFET in LFPAK using NextPower technology
N-channel 30 V 3.95mΩ logic level MOSFET in LFPAK using NextPower technology
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| File Size |
334.35K /
15 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
495-8025-A62
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| Description |
VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, right, adv mate, A-Key, 6.25mm (0.246in), Header.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
495-8025-C64
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| Description |
VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, right, adv mate, C-Key, 5.15mm (0.202in), Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
495-8025-F62
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| Description |
VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, right, adv mate, F-Key, 6.25mm (0.246in), Header.
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| Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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| Part No. |
PSMN3R7-25YLC
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| Description |
N-channel 25 V 3.9 m logic level MOSFET in LFPAK using NextPower technology
N-channel 25 V 3.9 mΩ logic level MOSFET in LFPAK using NextPower technology
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| File Size |
338.17K /
15 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
495-8025-H64
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| Description |
VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, right, adv mate, H-Key, 5.15mm (0.202in), Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77315-802-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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| Part No. |
PSMN3R2-25YLC
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| Description |
N-channel 25 V 3.4 m logic level MOSFET in LFPAK using NextPower technology
N-channel 25 V 3.4 mΩ logic level MOSFET in LFPAK using NextPower technology
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| File Size |
334.58K /
15 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
495-8025-B62
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| Description |
VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, right, adv mate, B-Key, 6.25mm (0.246in), Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
495-8025-D64
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| Description |
VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, right, adv mate, D-Key, 5.15mm (0.202in), Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
495-8025-G62
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| Description |
VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, right, adv mate, G-Key, 6.25mm (0.246in), Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77315-802-02LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75915-802HLF
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| Description |
Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 2 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Price and Availability
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