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  90136-1102 Datasheet PDF File

For 90136-1102 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0901362203

Molex Electronics Ltd.
Part No. 0901362203
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901361315 90136-1315

Molex Electronics Ltd.
Part No. 0901361315 90136-1315
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 15 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0901361230

Molex Electronics Ltd.
Part No. 0901361230
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.14K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-1208 0901361208

Molex Electronics Ltd.
Part No. 90136-1208 0901361208
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-102T12LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0901361318 90136-1318

Molex Electronics Ltd.
Part No. 0901361318 90136-1318
Description 2.54mm (.100) Pitch C-Grid III?Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 159.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 63411-102LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Right Angled Header, Through Hole, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    90136-1204 0901361204

Molex Electronics Ltd.
Part No. 90136-1204 0901361204
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 90311-028LF
Description Crimp-to-Wire Housing, Double Row, Pol. w/Latch, 28 Position
Tech specs    

Official Product Page

    90136-1207 0901361207

Molex Electronics Ltd.
http://
Part No. 90136-1207 0901361207
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 10083987-11023TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    90136-1132 0901361132

Molex Electronics Ltd.
Part No. 90136-1132 0901361132
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 68771-102HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-1130 0901361130

Molex Electronics Ltd.
Part No. 90136-1130 0901361130
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 73941-1020LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 90 Positions.
Tech specs    

Official Product Page

    90136-1118 0901361118

Molex Electronics Ltd.
Part No. 90136-1118 0901361118
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 10108777-11102TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

For 90136-1102 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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