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Amphenol Communications Solutions |
| Part No. |
20021832-04510T1LF
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| Description |
Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 10 positions, 1.27mm (0.500in) pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61082-204506LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87834-4441 0878344441
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13楼矛m (5楼矛) Gold (Au) Flash Plating
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| File Size |
112.89K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68020-458HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 58 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87834-1811 0878341811
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 18 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window
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| File Size |
127.51K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
67292-045LF
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| Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 90 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0878343441 87834-3441
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating
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| File Size |
113.17K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
61083-204509LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0878345045 87834-5045
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13渭m (5渭) Gold (Au) Selective Plating
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| File Size |
120.74K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
67292-045
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| Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 90 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61082-204502LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68020-450HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-204502LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10124620-4554P00LF
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| Description |
AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Right Angle Receptacle, Press-Fit
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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