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  87758-0850 Datasheet PDF File

For 87758-0850 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0877584650 87758-4650

Molex Electronics Ltd.
Part No. 0877584650 87758-4650
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Texas Instruments

Part No. 5962-87758012A
Description Octal Bus Transceivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0877581017 87758-1017

Molex Electronics Ltd.
Part No. 0877581017 87758-1017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 10 Circuits
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 10 Circuits

File Size 170.76K  /  4 Page

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Texas Instruments

Part No. 5962-8775801RA
Description Octal Bus Transceivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs    

Official Product Page

    0877581016

Molex Electronics Ltd.
Part No. 0877581016
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 10 Circuits

File Size 170.71K  /  4 Page

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Texas Instruments

Part No. 5962-8775801VSA
Description Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
Tech specs    

Official Product Page

    0877582250 87758-2250

Molex Electronics Ltd.
Part No. 0877582250 87758-2250
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Texas Instruments

Part No. 5962-8775801SA
Description Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
Tech specs    

Official Product Page

    0877584616 87758-4616

Molex Electronics Ltd.
Part No. 0877584616 87758-4616
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-111140850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0877583650 87758-3650

Molex Electronics Ltd.
Part No. 0877583650 87758-3650
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 10120850-002LF
Description HPCE VT Receptacle 36P32S
Tech specs    

Official Product Page

    0877580616 87758-0616

Molex Electronics Ltd.
Part No. 0877580616 87758-0616
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 54111-106040850LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580217 87758-0217

Molex Electronics Ltd.
Part No. 0877580217 87758-0217
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 2 Circuits, 0.76um (30u) Gold (Au) Selective Plating

File Size 170.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 54111-802030850LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87758-2650 0877582650

Molex Electronics Ltd.
Part No. 87758-2650 0877582650
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.48K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-109400850LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row, 40 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0877580216 87758-0216

Molex Electronics Ltd.
Part No. 0877580216 87758-0216
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 2 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.69K  /  4 Page

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Amphenol Communications Solutions

Part No. RJCSE508501
Description Modular Jack - Right Angle, Input Output Connectors 8P8C, Without Shield, With LEDs.
Tech specs    

Official Product Page

For 87758-0850 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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