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LT1964ES FSCM3GA NJW0302 8414NGML 89LE54RD TE28F160 04P15 37400
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  75730-0114 Datasheet PDF File

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    11-40-2118 1140-2118 0011-40-2118 001140-2118

Molex Electronics Ltd.
Part No. 11-40-2118 1140-2118 0011-40-2118 001140-2118
Description Terminator Die

File Size 19.94K  /  1 Page

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Amphenol Communications Solutions

Part No. 71757-300CALF
Description Card Bus Ass'y, Above Mount, D/D(136Pins), R/A, Type 123, 3.3V, 0mm s/o, Left Push Rod Eject, 9.5mm Eject Travel
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    73412-0110 73412-0112 73412-0114

Molex Electronics Ltd.
Part No. 73412-0110 73412-0112 73412-0114
Description MICRO COAXIAL CONNECTOR RECEPTACLE VERTICAL

File Size 136.66K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    11-40-2014 1140-2014 0011-40-2014 001140-2014

Molex Electronics Ltd.
Part No. 11-40-2014 1140-2014 0011-40-2014 001140-2014
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    022-55-2323 70450-0114

Molex Electronics Ltd.
Part No. 022-55-2323 70450-0114
Description 2.54mm (.100) Pitch SL Crimp Housing, Dual Row, Version C, Back Ribs, 32 Circuits
2.54mm (.100) Pitch SL?/a> Crimp Housing, Dual Row, Version C, Back Ribs, 32 Circuits
2.54mm (.100") Pitch SL垄芒 Crimp Housing, Dual Row, Version C, Back Ribs, 32 Circuits

File Size 114.57K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    1140-4200 0011-40-4200 001140-4200

Molex Electronics Ltd.
Part No. 1140-4200 0011-40-4200 001140-4200
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    11-40-4409 0011-40-4409 1140-4409 001140-4409

Molex Electronics Ltd.
Part No. 11-40-4409 0011-40-4409 1140-4409 001140-4409
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    1140-4203 001140-4203 0011-40-4203

Molex Electronics Ltd.
Part No. 1140-4203 001140-4203 0011-40-4203
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    201148B

Integrated Technology Future
Part No. 201148B
Description SAW Bandpass Filter

File Size 174.81K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    201142C

Integrated Technology Future
Part No. 201142C
Description SAW Bandpass Filter

File Size 176.19K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    HOKURIKU ELECTRIC INDUSTRY CO.,LTD
Part No. E011419
Description Packing Specification

File Size 188.70K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

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