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  73644-1011 Datasheet PDF File

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    0736440013

Molex Electronics Ltd.
Part No. 0736440013
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position G, 72 Circuits

File Size 159.09K  /  4 Page

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Rochester Electronics LLC

Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0736440012

Molex Electronics Ltd.
Part No. 0736440012
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position G, 72 Circuits

File Size 166.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0736440006

Molex Electronics Ltd.
Part No. 0736440006
Description 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location

File Size 166.79K  /  4 Page

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Amphenol Communications Solutions

Part No. 10118085-101-10LF
Description Unshrouded Right Angle Header, Surface Mount With Peg, Double row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0736440004 73644-0004

Molex Electronics Ltd.
Part No. 0736440004 73644-0004
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 72 Circuits

File Size 166.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114831-10112LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 12 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0736440002 73644-0002

Molex Electronics Ltd.
Part No. 0736440002 73644-0002
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 72 Circuits

File Size 166.79K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114829-10113LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions
Tech specs    

Official Product Page

    0736443000 73644-3000

Molex Electronics Ltd.
Part No. 0736443000 73644-3000
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits

File Size 164.67K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114828-10113LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    0736440001 73644-0001

Molex Electronics Ltd.
Part No. 0736440001 73644-0001
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press

File Size 167.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114830-10113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    73644-1003 0736441003

Molex Electronics Ltd.
Part No. 73644-1003 0736441003
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position B, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114831-10111LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 11 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0736443008 73644-3008

Molex Electronics Ltd.
Part No. 0736443008 73644-3008
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits

File Size 174.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114830-10112LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 12 Positions
Tech specs    

Official Product Page

    0736443007 73644-3007

Molex Electronics Ltd.
Part No. 0736443007 73644-3007
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position D, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position D, 144 Circuits

File Size 174.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 73644-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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