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  73412-0114 Datasheet PDF File

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    11-40-2014 1140-2014 0011-40-2014 001140-2014

Molex Electronics Ltd.
Part No. 11-40-2014 1140-2014 0011-40-2014 001140-2014
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 69173-412HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 7.49 mm (0.295 in.) Mating, 3.42 mm (0.135 in.) Tail
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1140-4200 0011-40-4200 001140-4200

Molex Electronics Ltd.
Part No. 1140-4200 0011-40-4200 001140-4200
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    1140-4203 001140-4203 0011-40-4203

Molex Electronics Ltd.
Part No. 1140-4203 001140-4203 0011-40-4203
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    11-40-4409 0011-40-4409 1140-4409 001140-4409

Molex Electronics Ltd.
Part No. 11-40-4409 0011-40-4409 1140-4409 001140-4409
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    SW65-0114 SW65-0114-TB SW65-0114TR

M/A-COM Technology Solutions, Inc.
Part No. SW65-0114 SW65-0114-TB SW65-0114TR
Description GaAs SPDT Absorptive Switch with ASIC Driver, DC-3.0 GHz

File Size 106.74K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    0011-40-4204 001140-4204

Molex Electronics Ltd.
Part No. 0011-40-4204 001140-4204
Description Conductor Anvil

File Size 15.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    001140-2193 0011-40-2193

Molex Electronics Ltd.
Part No. 001140-2193 0011-40-2193
Description Terminator Die

File Size 20.08K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    001140-4323 0011-40-4323

Molex Electronics Ltd.
Part No. 001140-4323 0011-40-4323
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    0011-40-2192 1140-2192 001140-2192

Molex Electronics Ltd.
Part No. 0011-40-2192 1140-2192 001140-2192
Description Terminator Die

File Size 19.91K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    11-40-4322 1140-4322 001140-4322 0011-40-4322

Molex Electronics Ltd.
Part No. 11-40-4322 1140-4322 001140-4322 0011-40-4322
Description Conductor Anvil

File Size 15.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

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