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  70543-0278 Datasheet PDF File

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    0705430112

Molex Electronics Ltd.
Part No. 0705430112
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 8Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 51940-278LF
Description PwrBlade®, Power Supply Connectors, 5P 28S 5P Vertical Receptacle.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0705430111

Molex Electronics Ltd.
Part No. 0705430111
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 7Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430109

Molex Electronics Ltd.
Part No. 0705430109
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded34 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs
File Size 418.27K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    70543-0001 0705430001

Molex Electronics Ltd.
Part No. 70543-0001 0705430001
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 2Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.27K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-435HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    70543-0002 0705430002

Molex Electronics Ltd.
Part No. 70543-0002 0705430002
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 3Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.27K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-432HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430122

Molex Electronics Ltd.
Part No. 0705430122
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 94937-0543LF
Description Header, Top Mount, Upper Deck(68Pins), 5V, 4.3mm s/o
Tech specs 　 　

Official Product Page

    0705430106

Molex Electronics Ltd.
Part No. 0705430106
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 2 Circuits, 0.76um (30u)
File Size 418.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-431HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430107

Molex Electronics Ltd.
Part No. 0705430107
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 61127-0543LF
Description Header, Top Mount, Upper Deck(68Pins), VTB, 3.3V, 4.3mm s/o
Tech specs 　 　

Official Product Page

    0705430110

Molex Electronics Ltd.
Part No. 0705430110
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 6Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-434HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430108

Molex Electronics Ltd.
Part No. 0705430108
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 4Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.27K  /  4 Page

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Download Datasheet

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