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  70543-0045 Datasheet PDF File

For 70543-0045 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0705430111

Molex Electronics Ltd.
Part No. 0705430111
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 7Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70543-0006 0705430006

Molex Electronics Ltd.
Part No. 70543-0006 0705430006
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 7Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0008 0705430008

Molex Electronics Ltd.
Part No. 70543-0008 0705430008
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 9Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-435HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0015 0705430015

Molex Electronics Ltd.
Part No. 70543-0015 0705430015
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 16Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch SL?/a> Header, Single Row, Vertical, .120 Pocket, Shrouded, 16Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-432HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0007 0705430007

Molex Electronics Ltd.
Part No. 70543-0007 0705430007
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 8Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 94937-0543LF
Description Header, Top Mount, Upper Deck(68Pins), 5V, 4.3mm s/o
Tech specs    

Official Product Page

    70545-0045

Molex Electronics Ltd.
Part No. 70545-0045
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 11 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Platin

File Size 252.66K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-431HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    Bel Fuse, Inc.
Part No. S473-0010-06 S473-0045-06
Description 1 TAP LEADING EDGE CONTROL LOW VOLTAGE DELAY MODULES ACTIVE DELAY LINE, TRUE OUTPUT, PDSO4

File Size 83.24K  /  1 Page

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Amphenol Communications Solutions

Part No. 61127-0543LF
Description Header, Top Mount, Upper Deck(68Pins), VTB, 3.3V, 4.3mm s/o
Tech specs    

Official Product Page

    14-60-0045 A-7040-0353

Molex Electronics Ltd.
Part No. 14-60-0045 A-7040-0353
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly,Female, Single Row, Version A, Nonpolarized, Wire Size 28, 3.81μm (150μ) Tin/Lead (SnPb), 4 Circuits

File Size 151.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 68705-434HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70563-0045

Molex Electronics Ltd.
Part No. 70563-0045
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 11Circuits, Tin (Sn) Plating

File Size 214.17K  /  4 Page

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Amphenol Communications Solutions

Part No. 10045103-002C-TRLF
Description SATA, Storage and Server Connector, Receptacle, Vertical, Surface Mount, 22 Positions
Tech specs    

Official Product Page

    70551-0045

Molex Electronics Ltd.
Part No. 70551-0045
Description 2.54mm (.100) Pitch SL Header, Single Row, Right Angle, .120 Pocket, Shroudedwith Beveled Plastic Peg, 11 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin

File Size 299.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 10045103-002CLF
Description SATA, Storage and Server Connector, Receptacle, Vertical, Surface Mount, 22 Positions
Tech specs    

Official Product Page

For 70543-0045 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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