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Amphenol Communications Solutions |
| Part No. |
131-6418-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87606-418LF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 36 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68466-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68016-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100) Pitch.
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Official Product Page
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Cypress Semiconductor, Corp.
Samtec, Inc.
Incon, Inc.
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| Part No. |
HD64180ZCPJ-6 HD64180ZCP-6 HD64180ZCP-4 HD64180ZFJ-8X HD64180ZCPJ-4 HD64180ZF-6 HD64180ZFJ-10X HD64180ZP-10X HD64180ZPJ-10X HD64180RCPJ-4
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| Description |
8-BIT, 6.17 MHz, MICROPROCESSOR, PQCC68 PLASTIC, LCC-68
8-BIT, 4 MHz, MICROPROCESSOR, PQCC68 PLASTIC, LCC-68
8-BIT, 8 MHz, MICROPROCESSOR, PQFP80 PLASTIC, FP-80
8-BIT, 6.17 MHz, MICROPROCESSOR, PQFP80 PLASTIC, FP-80
8-BIT, 10 MHz, MICROPROCESSOR, PQFP80 PLASTIC, FP-80
8-BIT, 10 MHz, MICROPROCESSOR, PDIP64 SHRINK, PLASTIC, DIP-64
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| File Size |
3,501.00K /
133 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
131-6418-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91276-418HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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Official Product Page
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Hynix Semiconductor, Inc.
HYNIX SEMICONDUCTOR INC
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| Part No. |
HYMR16418H-850 HYMR13218H-840 HYMR14818H-840 HYMR13216H-653 HYMR13216H-840 HYMR13216H-745 HYMR13216H-845 HYMR13218H-845
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| Description |
64M X 18 RAMBUS MODULE, 50 ns, DMA184 RIMM-184
32M X 18 RAMBUS MODULE, 40 ns, DMA184 RIMM-184
48M X 18 RAMBUS MODULE, 40 ns, DMA184 RIMM-184
32M X 16 RAMBUS MODULE, 53 ns, DMA184
32M X 16 RAMBUS MODULE, 40 ns, DMA184
32M X 16 RAMBUS MODULE, 45 ns, DMA184
32M X 18 RAMBUS MODULE, 45 ns, DMA184
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| File Size |
204.99K /
17 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
67996-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
52601-S26-418RLF
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| Description |
Quickie® IDC Cable-to-Board Connector System, Shrouded Vertical Header, Through Hole, Low Profile, Double Row, 25 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
146-4182-12D
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| Description |
Paladin HD, RAF, 4 Pair, 8 Column, NiS
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87916-418HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
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| Tech specs |
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Official Product Page
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Price and Availability
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