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  5130.2301 Datasheet PDF File

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    Teledyne Technologies I...
Part No. MTG5130
Description TWTs, Continuous Wave

File Size 39.51K  /  1 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TLP2301
Description Photocoupler (photo-IC output), 3750 Vrms, 4pin SO6
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HC55130

Intersil Corporation
Part No. HC55130
Description Ultra Low Power SLICs.(瓒??????ㄦ?绾胯矾?ュ??佃房

File Size 81.62K  /  7 Page

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Amphenol Communications Solutions

Part No. 68405-130HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    MPS Industries, Inc.
Part No. N5120 N5110 N5130
Description RJ-45 10/100 BASE-TX Jack with Magnetic Module

File Size 60.90K  /  2 Page

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Amphenol Communications Solutions

Part No. 85715-130LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Press-Fit, 2 Mod.
Tech specs    

Official Product Page

    PARA LIGHT ELECTRONICS ...
Part No. C-2301E
Description 2.24 INCH SINGLE DIGIT DISPLAY

File Size 206.13K  /  11 Page

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Amphenol Communications Solutions

Part No. 10132797-045130LF
Description BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 40 position, 4.3mm height plug connector.
Tech specs    

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    S2301

Rohm
Part No. S2301
Description N-channel SiC power MOSFET bare die

File Size 792.71K  /  12 Page

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Amphenol Communications Solutions

Part No. U95Z2454051301
Description ULTQSFP 2X2 COMBO 4LP&SPFG
Tech specs    

Official Product Page

    G2301

E-Tech Electronics LTD
Part No. G2301
Description P - C H A N N E L E N H A N C E M E N T M O D E P O W E R M O S F E T

File Size 389.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 10056845-130LF
Description Quickie Header, Wire to Board Connector, Double Row, 30 Positions, 2.54 mm (0.1 in.), Right Angle, Shrouded Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    Micropac Industries, Inc.
MICROPAC[Micropac Industries]
Part No. 52301
Description INSTRUMENTATION AMPLIFIER (PRELIMINARY) INSTRUMENTATION AMPLIFIER, 8000 uV OFFSET-MAX, 0.8 MHz BAND WIDTH, DIP14

File Size 210.00K  /  2 Page

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Amphenol Communications Solutions

Part No. 51915-130LF
Description PwrBlade®, Power Connectors, 20S 4P Right Angle Receptacle, Solder To Board
Tech specs    

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    N/A
Part No. 23017
Description Y2KC Nonvolatile Timekeeping RAM
RELAY 2 CHANNEL MONITOR 24V

File Size 104.66K  /  2 Page

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Amphenol Communications Solutions

Part No. 68705-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    2200-2301

COTO Technology
Part No. 2200-2301
Description Electromechanical Relay, RELAY REED SPST W/ES .5A 5VDC

File Size 80.09K  /  2 Page

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Amphenol Communications Solutions

Part No. 76745-130-48LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 48 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    S2301-16

Rohm
Part No. S2301-16
Description    N-channel SiC power MOSFET bare die

File Size 796.98K  /  13 Page

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Amphenol Communications Solutions

Part No. 84513-001LF
Description 100 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

For 5130.2301 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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