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  51240-0400 Datasheet PDF File

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    A-70400-0925

Molex Electronics Ltd.
Part No. A-70400-0925
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 28, 0.38μm (15μ) Gold (Au), 16 Circuits
File Size 162.80K  /  3 Page

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Amphenol Cables on Demand
Part No. SF-NDYYYF0004-001.5M
Description Amphenol SF-NDYYYF0004-001.5M 1.5m (4.9') 400GbE QSFP-DD Cable - Amphenol 400-Gigabit Ethernet Passive Copper QSFP Double Density Cable (Dual Entry 30 AWG) - QSFP-DD to QSFP-DD
Tech specs 　 　

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HUA FENG CIRCUIT





    A-70400-3155

Molex Electronics Ltd.
Part No. A-70400-3155
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 22, 3.81楼矛m (150楼矛") Tin/Lead (SnPb
File Size 162.46K  /  3 Page

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Amphenol Communications Solutions
Part No. 50645-1240ELF
Description High Pin Count, Backplane Connectors, Receptacle, Right Angle, 3 Row, 0 Guide Pin, Solder-less Press-Fit, 240 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

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    35572-0400

Molex Electronics Ltd.
Part No. 35572-0400
Description 2.50mm Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, Nylon 6/6
File Size 30.68K  /  1 Page

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Amphenol Communications Solutions
Part No. 77315-124-02LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    A-70400-3154

Molex Electronics Ltd.
Part No. A-70400-3154
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 22, 3.81楼矛m (150楼矛") Tin/Lead (SnPb
File Size 162.49K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-124-04LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

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    A-70400-3152

Molex Electronics Ltd.
Part No. A-70400-3152
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 22, 3.81楼矛m (150楼矛") Tin/Lead (SnPb
File Size 162.49K  /  3 Page

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Amphenol Communications Solutions
Part No. 76745-124-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    70400-0181 A-70400-0181

Molex Electronics Ltd.
Part No. 70400-0181 A-70400-0181
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female, Single Row, Version A, Nonpolarized, Wire Size 26, 3.81μm (150μ) Tin/Lead (SnPb)
File Size 150.74K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-124-07LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 7 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    A-70400-1134

Molex Electronics Ltd.
Part No. A-70400-1134
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 24, 0.76μm (30μ) Gold (Au), 15 Circuits
File Size 153.74K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-124-03LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    70400-3153 A-70400-3153

Molex Electronics Ltd.
Part No. 70400-3153 A-70400-3153
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 22, 3.81楼矛m (150楼矛") Tin/Lead (SnP
File Size 162.49K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-124-09LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 9 Positions 2.54 mm (0.100in) Pitch.
Tech specs 　 　

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    70400-3151 A-70400-3151

Molex Electronics Ltd.
Part No. 70400-3151 A-70400-3151
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 22, 3.81楼矛m (150楼矛") Tin/Lead (SnP
File Size 162.49K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-124-03
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    70400-3150 A-70400-3150

Molex Electronics Ltd.
Part No. 70400-3150 A-70400-3150
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 22, 3.81楼矛m (150楼矛") Tin/Lead (SnP
File Size 162.49K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-124-08LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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