| |
|
 |
Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TPN12008QM
|
| Description |
MOSFET, N-ch, 80 V, 26 A, 0.0123 Ohm@10V, TSON Advance
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
0010451111 AE-3003-11AG 10-45-1111
|
| Description |
5.08mm (.200) Pitch KK? Header, Vertical, Round Pin, 11 Circuits, Gold (Au) Plating,Pin Length 19.05mm (.750) 5.08mm (.200") Pitch KK庐 Header, Vertical, Round Pin, 11 Circuits, Gold (Au) Plating,Pin Length 19.05mm (.750") MOLEX Connector
|
| File Size |
301.26K /
5 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Toshiba Electronic Devices & Storage Corporation |
| Part No. |
XPN12006NC
|
| Description |
N-ch MOSFET, 60 V, 20 A, 0.0120 Ω@10V, TSON Advance(WF)
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
78511-119HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
89075-1111LF
|
| Description |
4 Row Signal Header, Straight, Press-Fit, 4 Mod
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10136647-051111LF
|
| Description |
Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Natural Color, 5 Positions, GW Compatible, with Posts, Tray packing.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
78511-118HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10137785-051111LF
|
| Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Natural Color, 5 Positions, GW Compatible, with Post, Tray packing.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
78511-111HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
G880051111C1HR
|
| Description |
Board mount - Header Receptacle - Wire to Board 1.25mm Pitch Vertical SMT,1x5Pin,Matte Tin,NY6T,Color-black ,T&R With MYLAR
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
78511-113HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
|

Bom2Buy.com

Price and Availability
|