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  43045-1809 Datasheet PDF File

For 43045-1809 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    43045-1025

Molex Electronics Ltd.
Part No. 43045-1025
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 10 Circuits
File Size 182.53K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-1810

Molex Electronics Ltd.
Part No. 43045-1810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 180.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-1812

Molex Electronics Ltd.
Part No. 43045-1812
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits
File Size 166.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-809282000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1818

Molex Electronics Ltd.
Part No. 43045-1818
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.78K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-809071800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1813

Molex Electronics Ltd.
Part No. 43045-1813
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits
File Size 166.55K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-118-09LF
Description BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions
Tech specs 　 　

Official Product Page

    43045-1817

Molex Electronics Ltd.
Part No. 43045-1817
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits
File Size 174.07K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-418-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1811

Molex Electronics Ltd.
Part No. 43045-1811
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 180.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-809161550LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1816

Molex Electronics Ltd.
Part No. 43045-1816
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits
File Size 174.08K  /  3 Page

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Amphenol Communications Solutions
Part No. 54122-105180950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 18 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    43045-1819

Molex Electronics Ltd.
Part No. 43045-1819
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.82K  /  3 Page

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Amphenol Communications Solutions
Part No. 54111-809201800LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-0810

Molex Electronics Ltd.
Part No. 43045-0810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 8 Circuits
File Size 180.50K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-809081450LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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