| |
|
 |
Amphenol Communications Solutions |
| Part No. |
75970-394-02LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,2 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
51940-394LF
|
| Description |
PwrBlade®, Power Supply Connectors, 10P 20S 10P Vertical Receptacle.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77313-518-24LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 24 Positions
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77313-518-28LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 26 Positions
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-3518-21H
|
| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, APP.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77313-518-20LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 20 Positions
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
14-60-1101 0014601101 70400-0394 A-70400-0394
|
| Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 28, 3.81μm (150μ) Tin/Lead (SnPb)
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 28, 3.81μm (150μ) Tin/Lead (SnPb)
|
| File Size |
159.03K /
3 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77313-518-22LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 22 Positions
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77313-518-26LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 26 Positions
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-3518-21D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
