| |
|
 |
Amphenol Communications Solutions |
| Part No. |
57102-S08-17LF
|
| Description |
Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
57102-F08-17LF
|
| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 34 Positions - 2mm (0.079inch) - Vertical
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
108-1711-100
|
| Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, Guide Module, With Post, No Key.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
59202-F40-08-174LF
|
| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
|
| Part No. |
ADC0817CCN/A ADC0816CJ/A
|
| Description |
Quad 18MHz, Low Noise, Rail-to-Rail, CMOS Op Amp; Package: DFN; No of Pins: 16; Temperature Range: -40°C to 85°C
Quad 18MHz, Low Noise, Rail-to-Rail, CMOS Op Amp; Package: SSOP; No of Pins: 16; Temperature Range: 0°C to 70°C 模拟到数字转换器
|
| File Size |
643.30K /
13 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54101-G0817LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54201-G0817LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54102-T0817LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 34 Positions, 2.54mm (0.100in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54122-111081700LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54112-109081700LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
57102-G08-17LF
|
| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 34 Positions - 2mm (0.079inch) - Vertical
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
|
|
JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 101-0817 |
| Maker: Rabbit Semiconductor |
| Pack: ETC |
| Stock: Reserved |
| Unit price
for : |
|
50: $0.00 |
|
100: $0.00 |
| 1000:
$0.00 |
|
Email: oulindz@gmail.com |
|
Contact us |
|
|
