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59446 PMB2304R TF201 MC33794D 1N1184 4FCT2 151K1 AOD498
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  030-7766.0 Datasheet PDF File

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    22-43-3030

Molex Electronics Ltd.
Part No. 22-43-3030
Description 2.5 SPOX IDT RECEPTACLE WHITE 3CKT

File Size 301.83K  /  4 Page

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Amphenol Communications Solutions

Part No. 54776-605-36LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MILL-MAX MFG CORP
Part No. 0300-0-15-80-47-80-10-0
Description BERYLLIUM COPPER, TIN (200) OVER NICKEL FINISH, PCB TERMINAL

File Size 325.21K  /  1 Page

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Amphenol Communications Solutions

Part No. 54776-604-06LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

   
Part No. 5030-11
Description INTERCONNECTION DEVICE

File Size 36.60K  /  1 Page

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Amphenol Communications Solutions

Part No. 54776-602-36LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    05-06-0304 05-06-0304-C

Molex Electronics Ltd.
Part No. 05-06-0304 05-06-0304-C
Description TERMINAL FOR .020/(0.51) X .187/(4.75) SPADE

File Size 43.72K  /  1 Page

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Amphenol Communications Solutions

Part No. 54776-604-20LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 20 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    14-56-4030

Molex Electronics Ltd.
Part No. 14-56-4030
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 24, 0.76μm (30μ) Gold (Au), 3 Circuits
2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 24, 0.76楼矛m (30楼矛") Gold (Au), 3 Circ

File Size 139.37K  /  3 Page

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Amphenol Communications Solutions

Part No. 439-5J77-660
Description GbX ,Backplane connectors,4 pair Power, 1-Up
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 08-03-0303
Description Crimp Socket Contact; Wire Size (AWG):24-18; Contact Material:Brass RoHS Compliant: Yes BRASS, TIN LEAD FINISH, WIRE TERMINAL

File Size 96.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 439-6P77-666
Description GbX ,Backplane connectors,5 pair Power, 2-Up
Tech specs    

Official Product Page

    22-28-0030

Molex Electronics Ltd.
Part No. 22-28-0030
Description 2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, Tin (Sn) Plating

File Size 167.68K  /  6 Page

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Texas Instruments

Part No. 5962-8776601SA
Description Hex 2-Input NAND Drivers 20-CFP -55 to 125
Tech specs    

Official Product Page

   
Part No. 100-030-133
Description 30 CONTACT(S), MALE, STRAIGHT TWO PART EURO CONNECTOR, SOLDER

File Size 198.87K  /  2 Page

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Texas Instruments

Part No. 5962-8776601RA
Description Hex 2-Input NAND Drivers 20-CDIP -55 to 125
Tech specs    

Official Product Page

    22-28-1030

Molex Electronics Ltd.
Part No. 22-28-1030
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Friction Lock, 3 Circuits, Tin (Sn) Plating

File Size 311.12K  /  8 Page

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Texas Instruments

Part No. 5962-87766012A
Description Hex 2-Input NAND Drivers 20-LCCC -55 to 125
Tech specs    

Official Product Page

    Asahi Kasei Microsystem...
Part No. MS-0030
Description Semiconductor Magnetoresistive Element

File Size 386.25K  /  8 Page

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