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Molex Electronics Ltd.
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| Part No. |
0015477546 15-47-7546
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 46 Circuits
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 46 Circuits
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| File Size |
377.28K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68015-415HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015477548 15-47-7548
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, Tin (Sn) Plating
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| File Size |
377.28K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68015-410HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015477560 15-47-7560
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, Tin (Sn) Plating
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| File Size |
377.28K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68015-406HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 6 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015477562 15-47-7562
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, Tin (Sn) Plating
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| File Size |
377.28K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68020-154HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 54 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68015-407HALF
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| Description |
BS SR RA HDR TR 1X7
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59202-G38-20-154LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68015-401HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68015-416HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68015-421HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 21 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68015-424HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 24 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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