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  TEL3-2013 Datasheet PDF File

For TEL3-2013 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    INTEL[Intel Corporation]
Part No. 272420-007 80386EX INTEL38B6
Description Intel386 EX Embedded Microprocessor

File Size 396.57K  /  56 Page

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Amphenol Communications Solutions

Part No. 51752-013LF
Description PwrBlade®, Power Supply Connectors, 14P 32S Vertical Receptacle.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SAMSUNG[Samsung semiconductor]
Part No. KSR2013
Description PNP (SWITCHING APPLICATION)

File Size 31.07K  /  1 Page

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Amphenol Communications Solutions

Part No. 51952-013LF
Description PwrBlade®, Power Supply Connectors, 1P 24S 1P Vertical Header.
Tech specs    

Official Product Page

   
Part No. E002013
Description From old datasheet system

File Size 90.19K  /  1 Page

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Amphenol Communications Solutions

Part No. L17H1120131
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=15.88mm (0.625in), 9/9 (Pin/Socket), Flash Gold, Bright Tin Shell, 4-40 Removable Front Screwlock, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    TO52013

Vanlong Technology Co., Ltd.
Vanlong Technology Co., Ltd...
Part No. TO52013
Description Temperature Compensated Crystal Oscillator

File Size 31.94K  /  1 Page

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Amphenol Communications Solutions

Part No. 74817-2013LF
Description Metral® High Speed 1000 Series, Backplane Connectors, Header, Vertical Signal, 5 Row, Press-Fit, 30 Position, Select Load, Standard
Tech specs    

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    CXA2013

Sony Corporation
Part No. CXA2013
Description CAP, SMT(V), FILM, 1UF, 100V, 10%

File Size 199.84K  /  23 Page

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Amphenol Communications Solutions

Part No. 68020-138HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 38 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

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Part No. DS2013N-80 DS2013N-65
Description x9 Asynchronous FIFO

File Size 54.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 65692-013LF
Description Quickie® Slimline Header, Wire To Board, Through Hole, Vertical, Double Row, 26 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    LANSDALE Semiconductor ...
Part No. ML12013-08
Description MECL PLL Components Dual Modulus Prescaler

File Size 5,377.46K  /  15 Page

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Amphenol Communications Solutions

Part No. 54122-119201300LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

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    201302B

Integrated Technology Future
Part No. 201302B
Description SAW Bandpass Filter

File Size 180.22K  /  5 Page

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Amphenol Communications Solutions

Part No. G823J201321DHR
Description Board mount - Header Receptacle - Box Header For USB 3.0,2.0mm Pitch Vertical DIP,2x10Pin,30u\\Gold,NY9T,Removed#20Pos,With Latch,TAIL=3.3mm,Color-Black
Tech specs    

Official Product Page

    TC62013

Microchip Technology
Part No. TC62013
Description 5V, Dual Trip Point Temperature Sensors

File Size 134.69K  /  16 Page

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Amphenol Communications Solutions

Part No. L17H1220130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=15.88mm (0.625in), 9/9 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    TOSHIBA
Part No. 2SK2013
Description Field Effect Transistor Silicon N Channel MOS Type Audio Frequency Power Amplifier Application

File Size 148.64K  /  4 Page

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Amphenol Communications Solutions

Part No. 75168-201-36LF
Description BERGSTIK
Tech specs    

Official Product Page

For TEL3-2013 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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