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Lite-On Technology, Corp. HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
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| Part No. |
HSDL-9000 HSDL9000
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| OCR Text |
... shorting. Aperture opening for shield pad is 1.5 mm x 0.6 mm as per land pattern.
APERTURES AS PER LAND DIMENSION 0.152
4.7 3.14
Figure 9. Solder stencil aperture.
1.3 Adjacent Land Keepout and Solder Mask Areas Adjacent land k... |
| Description |
Miniature Surface-Mount Ambient Light Photo Sensor 微型表面贴装环境亮度传感
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| File Size |
267.19K /
14 Page |
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it Online |
Download Datasheet
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N.A.
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| Part No. |
PA-1001A1B
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| OCR Text |
...atly reduces this coupling. The shield should be grounded on both ends of the cable. However, even with proper interconnecting cabling, cros...metal enclosure such as a suitable NEMA 4 (e.g. GUAC) junction box. The enclosure must be properly g... |
| Description |
SIGNAL CONDITIONER & CONVERTERS
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| File Size |
189.88K /
12 Page |
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it Online |
Download Datasheet
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Agilent
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| Part No. |
HSDL-9000
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| OCR Text |
... shorting. Aperture opening for shield pad is 1.5 mm x 0.6 mm as per land pattern.
APERTURES AS PER LAND DIMENSION
0.152
4.7
3.14
Figure 9. Solder stencil aperture.
1.3 Adjacent Land Keepout and Solder Mask Areas Adjacent la... |
| Description |
Optoelectronic Miscellaneous
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| File Size |
130.55K /
14 Page |
View
it Online |
Download Datasheet
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Price and Availability
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