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Amphenol Communications Solutions |
| Part No. |
76345-804-30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 30 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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| Part No. |
PSMN3R7-25YLC
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| Description |
N-channel 25 V 3.9 m logic level MOSFET in LFPAK using NextPower technology N-channel 25 V 3.9 mΩ logic level MOSFET in LFPAK using NextPower technology
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| File Size |
338.17K /
15 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
75915-804
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| Description |
Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 4 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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| Part No. |
PSMN3R2-25YLC
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| Description |
N-channel 25 V 3.4 m logic level MOSFET in LFPAK using NextPower technology N-channel 25 V 3.4 mΩ logic level MOSFET in LFPAK using NextPower technology
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| File Size |
334.58K /
15 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
76345-804-12LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 12 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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| Part No. |
PSMN3R7-30YLC
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| Description |
N-channel 30 V 3.95m logic level MOSFET in LFPAK using NextPower technology N-channel 30 V 3.95mΩ logic level MOSFET in LFPAK using NextPower technology
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| File Size |
334.35K /
15 Page |
View
it Online |
Download Datasheet
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|
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Amphenol Communications Solutions |
| Part No. |
76345-804-08LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 8 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75915-804HLF
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| Description |
Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 4 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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|
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Amphenol Communications Solutions |
| Part No. |
75915-804LF
|
| Description |
Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 4 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
76345-804-26LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 26 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
76345-804-08
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 8 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
5962-9455804NZB
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| Description |
Digital Signal Processor 132-BQFP -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
AFE5804ZCF
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| Description |
8-Channel Analog Front End for Ultrasound 135-NFBGA 0 to 70
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| Tech specs |
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Official Product Page
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