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  HLMP-3315.E3R1 Datasheet PDF File

For HLMP-3315.E3R1 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    MC33153

ON Semiconductor
Part No. MC33153
Description Single IGBT Gate Driver(??GBT?ㄩ┍?ㄥ?)

File Size 194.09K  /  15 Page

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Amphenol Communications Solutions

Part No. 10131933-150ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Double row, 50 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MC33152

ON Semiconductor
Part No. MC33152
Description (MC33152 / MC34152) HIGH SPEED DUAL MOSFET DRIVERS

File Size 180.35K  /  12 Page

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Amphenol Communications Solutions

Part No. 69133-152HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 52 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    INTEGRAL[Integral Corp.]
Part No. IL33153
Description SINGLE IGBT GATE DRIVER

File Size 121.67K  /  3 Page

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Amphenol Communications Solutions

Part No. 78233-156HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 56 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

   
Part No. PCD3315
Description 8-BIT MICROCONTROLLER 8位微控制

File Size 87.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 76745-331-50LF
Description BERGSTIK
Tech specs    

Official Product Page

    MC33153-D

ON Semiconductor
Part No. MC33153-D
Description Single IGBT Gate Driver

File Size 135.30K  /  16 Page

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Amphenol Communications Solutions

Part No. 10118744-3133151LF
Description C - Commercial Series; Mezzanine Receptacle, SMT; 1mm Pitch; 51p
Tech specs    

Official Product Page

    KK33153

KODENSHI KOREA CORP.
Part No. KK33153
Description SINGLE IGBT GATE DRIVER

File Size 88.63K  /  4 Page

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Amphenol Communications Solutions

Part No. 69133-154HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 54 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TOSHIBA
Part No. TLP3315
Description Photorelay (MOSFET output, 1-form-a)

File Size 195.82K  /  7 Page

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Amphenol Communications Solutions

Part No. 78233-158HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 58 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Toshiba
Part No. TLP3315
Description Photocouplers / Photorelay

File Size 216.75K  /  7 Page

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Amphenol Communications Solutions

Part No. 380-3315-200
Description Receptacle MOD,INFINX 4 Pair,9 Position,24.5MM, 100MΩ, w/lossy
Tech specs    

Official Product Page

    IRF3315

International Rectifier
Part No. IRF3315
Description Power MOSFET(Vdss=150V, Rds(on)=0.07ohm, Id=27A)

File Size 121.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 68683-315LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 30 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

   
Part No. HLMP-1719-S22
Description T-1 SINGLE COLOR LED, YELLOW, 2.925 mm

File Size 114.69K  /  5 Page

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Amphenol Communications Solutions

Part No. 69133-150HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For HLMP-3315.E3R1 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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