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  CY8C3665LTI-004 Datasheet PDF File

For CY8C3665LTI-004 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    A-2004-2-4-N-R

Assmann Electronics Inc.
Part No. A-2004-2-4-N-R
Description MODULAR JACK, 8P8C

File Size 269.68K  /  1 Page

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HUA FENG CIRCUIT





    A-2004-1-4-N-R

Assmann Electronics Inc.
Part No. A-2004-1-4-N-R
Description MODULAR JACK, 6P6C

File Size 269.13K  /  1 Page

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    A-2004-2-4-R

Assmann Electronics Inc.
Part No. A-2004-2-4-R
Description MODULAR JACK, 8P8C

File Size 280.65K  /  1 Page

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    Asahi Kasei Microsystem...
Part No. MS-0041
Description Semiconductor Magnetoresistive Element

File Size 218.87K  /  7 Page

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    Assmann Electronics Inc...
Part No. A-2004-0-1
Description Glass Filled Polyster

File Size 186.13K  /  1 Page

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    22-28-0043

Molex Electronics Ltd.
Part No. 22-28-0043
Description KK? 254 Breakaway Header, Vertical, with Friction Lock, 4 Circuits, Tin (Sn) Plating. with Kinked PC Tails

File Size 66.21K  /  2 Page

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    22-28-0041

Molex Electronics Ltd.
Part No. 22-28-0041
Description KK? 254 Breakaway Header, Vertical, with Friction Lock, 4 Circuits, 0.38μm Gold (Au) Selective Plating

File Size 66.20K  /  2 Page

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    22-28-0040

Molex Electronics Ltd.
Part No. 22-28-0040
Description KK? 254 Breakaway Header, Vertical, with Friction Lock, 4 Circuits, Tin (Sn) Plating

File Size 66.19K  /  2 Page

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    Molex, Inc.
Part No. 15-06-0042
Description MiniFit BMI Rcpt/PanMnt 4Ckt 4 CONTACT(S), FEMALE, POWER CONNECTOR, RECEPTACLE

File Size 200.63K  /  2 Page

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    NSL-37-004 NSL-37-034

API Delevan
Part No. NSL-37-004 NSL-37-034
Description Compact, moisture resistant package

File Size 91.09K  /  1 Page

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For CY8C3665LTI-004 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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Part: CY8C3665LTI-004
Maker: Cypress Semiconductor Corp
Pack: ETC
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