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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TB62210FNG
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| Description |
Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=1/Phase Interface
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78290-136HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68690-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69190-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-2306 0901362306
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
254.43K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
20021221-00010T4LF
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| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 10 Positions, 1.27mm (0.500in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131319-2222100LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021221-00008T4LF
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| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 8 Positions, 1.27mm (0.500in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021221-000A0D8LF
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| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 100 Positions, 1.27mm (0.500in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-2302 0901362302
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
254.43K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
98122-1001LF
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| Description |
Metral® High Speed 1000 Series, Backplane Connectors, Header, Vertical Signal, 5 Row, Press-Fit, 30 Position, Select Load, Extended
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021221-00040D4LF
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| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 40 Positions, 1.27mm (0.500in) Pitch.
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| Tech specs |
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Official Product Page
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Price and Availability
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