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  90136-1205 Datasheet PDF File

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    0901362203

Molex Electronics Ltd.
Part No. 0901362203
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901362204 90136-2204

Molex Electronics Ltd.
Part No. 0901362204 90136-2204
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 254.60K  /  5 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0901362205 90136-2205

Molex Electronics Ltd.
Part No. 0901362205 90136-2205
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 254.69K  /  5 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-1132 0901361132

Molex Electronics Ltd.
Part No. 90136-1132 0901361132
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. G832MB131205122HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold White.
Tech specs    

Official Product Page

    0901361302 90136-1302

Molex Electronics Ltd.
Part No. 0901361302 90136-1302
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 68001-205HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 5 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2309 0901362309

Molex Electronics Ltd.
Part No. 90136-2309 0901362309
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 9 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 9 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. G874D061205C1EU
Description Mini power, Vertical, Dual row, 4.2mm pitch, 6 positions , 100u\\ Tin, 3.50mm tail length, LCP, Black, TRAY
Tech specs    

Official Product Page

    90136-2308 0901362308

Molex Electronics Ltd.
Part No. 90136-2308 0901362308
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 98426-S12-05-210LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    90136-2307 0901362307

Molex Electronics Ltd.
Part No. 90136-2307 0901362307
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 470-1205-100
Description Receptacle. mod,10Positions, 20.5mm, NEXLEV
Tech specs    

Official Product Page

    90136-1130 0901361130

Molex Electronics Ltd.
Part No. 90136-1130 0901361130
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. G832ME131205022HR
Description Pitch 0.8mm, Height 7.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash White
Tech specs    

Official Product Page

    90136-1207 0901361207

Molex Electronics Ltd.
http://
Part No. 90136-1207 0901361207
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. G832MB031205222HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 120 Positions, Dual Row, BTB Vertical Receptacle SMT, 30u\\ Gold White.
Tech specs    

Official Product Page

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