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Amphenol Communications Solutions |
| Part No. |
75844-879-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54202-G08-06P
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143216 87914-3216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
75160-806-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,10 position, 2.54mm pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879144816
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.74K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
57102-F08-06LF
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| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 12 Positions - 2mm (0.079inch) - Vertical
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143416 87914-3416
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54102-G0806LF
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| Description |
54102-G0806LF-DUPLEX
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-101080600RLF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68020-408-061033LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10142708-06200LF
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| Description |
Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 6 Positions, 100u\\ Tin overall plating, GW Compatible LCP, With Pegs, Tray.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-808061500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51720-10600806AALF
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| Description |
PwrBlade®, Power Supply Connectors, 6P 8S 6P Right Angle Header.
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Official Product Page
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Bom2Buy.com
Price and Availability
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