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  87914-0616 Datasheet PDF File

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    87914-8016 0879148016

Molex Electronics Ltd.
Part No. 87914-8016 0879148016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 80 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Lead-free

File Size 3,779.54K  /  48 Page

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Amphenol Communications Solutions

Part No. 75844-879-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0879145016 87914-5016

Molex Electronics Ltd.
Part No. 0879145016 87914-5016
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.55K  /  48 Page

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Amphenol Communications Solutions

Part No. 87061-617
Description Quickie®, Wire to Board Connector, Double Row, 68 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header
Tech specs    

Official Product Page

    0879144405 87914-4405

Molex Electronics Ltd.
Part No. 0879144405 87914-4405
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free

File Size 4,415.94K  /  57 Page

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Amphenol Communications Solutions

Part No. 54122-806161250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87914-2816 0879142816

Molex Electronics Ltd.
Part No. 87914-2816 0879142816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.54K  /  48 Page

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Amphenol Communications Solutions

Part No. 10121506-160012BLF
Description HPCE STD VT Receptacle 16P12S
Tech specs    

Official Product Page

    87914-3816 0879143816

Molex Electronics Ltd.
Part No. 87914-3816 0879143816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 38 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 10121506-160012DLF
Description HPCE STD VT Receptacle 16P12S
Tech specs    

Official Product Page

    0879140816

Molex Electronics Ltd.
Part No. 0879140816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions

Part No. 98414-F06-16ULF
Description Minitek®, Board/Wire to Board Connector, 2.00mm (0, 079in), Shrouded Vertical Header, Through Hole, Double Row, 16 positions
Tech specs    

Official Product Page

    0879144416 87914-4416

Molex Electronics Ltd.
Part No. 0879144416 87914-4416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 44 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 54112-806161000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0879142016

Molex Electronics Ltd.
Part No. 0879142016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 20 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions

Part No. 87061-605LF
Description Quickie® IDC Cable-to-Board Connector System, Eject Latch Header, Through Hole, Right Angle, Double Row, Stacked 4 Wall, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0879144204

Molex Electronics Ltd.
Part No. 0879144204
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, Lead-free

File Size 4,416.61K  /  57 Page

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Amphenol Communications Solutions

Part No. 98414-G06-16LF
Description Minitek®, Board/Wire to Board Connectors, Shrouded Header - Through Mount - Double row - 16 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    43L0616A

AMIC Technology
Part No. 43L0616A
Description Search --To A43L0616A

File Size 1,085.54K  /  45 Page

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Amphenol Communications Solutions

Part No. 68020-616
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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