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Molex Electronics Ltd.
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| Part No. |
87911-1611 0879111611
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 16 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.87K /
6 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54112-107641100LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 64 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131764-11JLF
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| Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 10 column, 200 position, Right Angle Receptacle, Right Guide Pin.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G832MB030641122HR
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| Description |
0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 3.7 mm, 64 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold White.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-1811 0879111811
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 18 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.87K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
87916-411HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-2811 0879112811
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68016-411HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 11 Positions, 2.54 mm (0.100) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-5411 0879115411
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 54 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 54 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68764-118HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 18 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-7811 0879117811
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| Description |
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 78 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 78 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10029364-111LF
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| Description |
SATA, Storage and Server Connector, Receptacle, Right Angle, Surface Mount, 22 Positions
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-3607 0879113607
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100") Pitch C-Grid庐 Header, Right Angle, Through Hole, 36 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
486.74K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJE581886411
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| Description |
Modular Jack - High Performance, Input Output Connectors 8P8C, Without Shield, With LEDs.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-3611 0879113611
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 36 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.90K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10131319-064110PLF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 30u\\ Gold on Contact area (100u\\ Matte Tin on Tails) plating, Natural Color, 6 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879111411 87911-1411
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.70K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
G832MB010641122HR
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| Description |
0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 3.7 mm, 64 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold Black.
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| Tech specs |
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Official Product Page
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