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  87832-0808 Datasheet PDF File

For 87832-0808 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87832-0634

Molex Electronics Ltd.
Part No. 87832-0634
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Center Polarization Slot

File Size 110.67K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-808081200LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 8 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87832-0410

Molex Electronics Ltd.
Part No. 87832-0410
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 4 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Window, without Cap

File Size 215.73K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-808081350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-0411

Molex Electronics Ltd.
Part No. 87832-0411
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 4 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Locking Window

File Size 212.38K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-108081600LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-0606

Molex Electronics Ltd.
Part No. 87832-0606
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Window

File Size 215.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-408081250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87832-0608

Molex Electronics Ltd.
Part No. 87832-0608
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Window

File Size 215.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 54201-T0808LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-0609

Molex Electronics Ltd.
Part No. 87832-0609
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Locking Window

File Size 212.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-408081300LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87832-4012

Molex Electronics Ltd.
Part No. 87832-4012
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 40 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 345.42K  /  5 Page

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Amphenol Communications Solutions

Part No. 10142708-08000LF
Description Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 8 Positions, 30u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, With Pegs, Tray.
Tech specs    

Official Product Page

    87832-2620

Molex Electronics Ltd.
Part No. 87832-2620
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 26 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.52K  /  6 Page

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Amphenol Communications Solutions

Part No. 54202-G0808AB07LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double row , 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87832-2622

Molex Electronics Ltd.
Part No. 87832-2622
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 26 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap

File Size 367.61K  /  6 Page

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Amphenol Communications Solutions

Part No. 10125394-T0808ALF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double row , 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87832-4620

Molex Electronics Ltd.
Part No. 87832-4620
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 46 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.53K  /  6 Page

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Amphenol Communications Solutions

Part No. 54201-G0808PA05LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 87832-0808 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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