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Molex Electronics Ltd.
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| Part No. |
0877600817 87760-0817
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
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| File Size |
154.96K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
77311-846-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877600818 87760-0818
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 8 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 8 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray, Lead-free
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| File Size |
154.75K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
131-4616-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877601046 87760-1046
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
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| File Size |
102.07K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-146-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-846-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-4616-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87760-2816 0877602816
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
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| File Size |
160.34K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
131-4616-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132446-16LF
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| Description |
Minitek® Pwr 3.0 HCC, Plug Housing, 16 Positions, Black Color, GW Compatible.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87760-1816 0877601816
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
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| File Size |
160.35K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
131-4616-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877601618 87760-1618
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 16 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 16 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray, Lead-free
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| File Size |
160.06K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
DWRT200PM14616
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| Description |
COOLPOWER MEZZANINE
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877601617 87760-1617
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
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| File Size |
160.17K /
4 Page |
View
it Online |
Download Datasheet |
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