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  87759-4475 Datasheet PDF File

For 87759-4475 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87759-1664

Molex Electronics Ltd.
Part No. 87759-1664
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 420.97K  /  8 Page

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Amphenol Communications Solutions

Part No. 447-5025-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 25 positions, open, 4.75mm (0.187in), Header.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-3465

Molex Electronics Ltd.
Part No. 87759-3465
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 447-5025-063
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 25 positions, open, 4.25mm (0.167in), Header.
Tech specs    

Official Product Page

    87759-1415

Molex Electronics Ltd.
Part No. 87759-1415
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.56K  /  6 Page

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Amphenol Communications Solutions

Part No. 447-5010-063
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 10 positions, open, 4.25mm (0.167in), Header.
Tech specs    

Official Product Page

    87759-2474

Molex Electronics Ltd.
Part No. 87759-2474
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 447-5025-062
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 25 positions, open, 6.25mm (0.246in), Header.
Tech specs    

Official Product Page

    87759-7634

Molex Electronics Ltd.
Part No. 87759-7634
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs

File Size 355.91K  /  6 Page

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Amphenol Communications Solutions

Part No. 447-5010-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 10 positions, open, 4.75mm (0.187in), Header.
Tech specs    

Official Product Page

    87759-7633

Molex Electronics Ltd.
Part No. 87759-7633
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 355.89K  /  6 Page

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Amphenol Communications Solutions

Part No. 447-5010-062
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 10 positions, open, 6.25mm (0.246in), Header.
Tech specs    

Official Product Page

    87759-7637

Molex Electronics Ltd.
Part No. 87759-7637
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 355.71K  /  6 Page

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Amphenol Communications Solutions

Part No. 10034475-101LF
Description AirMax VS®, Backplane Connectors, 5-Pair, 150 -position, 2mm pitch, 10 column, Right Angle Receptacle.
Tech specs    

Official Product Page

    87759-3464

Molex Electronics Ltd.
Part No. 87759-3464
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 34 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 420.98K  /  8 Page

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Amphenol Communications Solutions

Part No. 10144754-1611LF
Description Minitek® Pwr 3.0 BMI, Dual Row, Right Angle Through Hole Header, 80u\\ Tin overall plating, 16 Positions, Black Color, LCP, GW Compatible, Tray packing.
Tech specs    

Official Product Page

    87759-3276

Molex Electronics Ltd.
Part No. 87759-3276
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 355.72K  /  6 Page

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Amphenol Communications Solutions

Part No. 10144754-0631LF
Description Minitek® Pwr 3.0 BMI, Dual Row, Right Angle Through Hole Header, 15u\\ Gold plating, 6 Positions, Black Color, LCP, GW Compatible, Tray packing.
Tech specs    

Official Product Page

    87759-1665

Molex Electronics Ltd.
Part No. 87759-1665
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

View it Online

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Amphenol Communications Solutions

Part No. 10144754-0641LF
Description Minitek® Pwr 3.0 BMI, Dual Row, Right Angle Through Hole Header, 30u\\ Gold plating, 6 Positions, Black Color, LCP, GW Compatible, Tray packing.
Tech specs    

Official Product Page

For 87759-4475 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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