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  87759-2864 Datasheet PDF File

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    87759-3874

Molex Electronics Ltd.
Part No. 87759-3874
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 10122864-418002LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-1414

Molex Electronics Ltd.
Part No. 87759-1414
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.27K  /  8 Page

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Amphenol Communications Solutions

Part No. 10122864-418002CLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4864

Molex Electronics Ltd.
Part No. 87759-4864
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 420.98K  /  8 Page

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Amphenol Communications Solutions

Part No. 10122864-418002ALF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-3864

Molex Electronics Ltd.
Part No. 87759-3864
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging

File Size 420.91K  /  8 Page

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    87759-4215

Molex Electronics Ltd.
Part No. 87759-4215
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.39K  /  6 Page

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    87759-4265

Molex Electronics Ltd.
Part No. 87759-4265
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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    87759-4815

Molex Electronics Ltd.
Part No. 87759-4815
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.40K  /  6 Page

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    87759-1450

Molex Electronics Ltd.
Part No. 87759-1450
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 174.22K  /  4 Page

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    87759-3464

Molex Electronics Ltd.
Part No. 87759-3464
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 34 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 420.98K  /  8 Page

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    87759-4664

Molex Electronics Ltd.
Part No. 87759-4664
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Surface Mount, Vertical, 46 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-

File Size 421.17K  /  8 Page

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