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  70567-0120 Datasheet PDF File

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    A-70567-0282 0015800249

Molex Electronics Ltd.
Part No. A-70567-0282 0015800249
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Rochester Electronics LLC

Part No. 27C010-120DI
Description 27C010 - 1024K (128K x 8) CMOS EPROM
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A-70567-0283 0015800269

Molex Electronics Ltd.
Part No. A-70567-0283 0015800269
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 10120818-001CLF
Description SAS 3.0 Connectors, Storage & Server System, Receptacle, Vertical, Surface Mount, 29 Positions, 12Gb/s.
Tech specs    

Official Product Page

    A-70567-0215 0015800267

Molex Electronics Ltd.
Part No. A-70567-0215 0015800267
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits

File Size 1,218.31K  /  7 Page

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Amphenol Communications Solutions

Part No. 76350-120-22LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 22 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    A-70567-0285 15-80-0309 0015800309

Molex Electronics Ltd.
Part No. A-70567-0285 15-80-0309 0015800309
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.34K  /  7 Page

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Amphenol Communications Solutions

Part No. 93690-101-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    A-70567-0358 15-80-1401 0015801401

Molex Electronics Ltd.
Part No. A-70567-0358 15-80-1401 0015801401
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 75970-120-30LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    A-70567-0349 15-80-1221 0015801221

Molex Electronics Ltd.
Part No. A-70567-0349 15-80-1221 0015801221
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 68001-205HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 5 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015800507 A-70567-0227 15-80-0507

Molex Electronics Ltd.
Part No. 0015800507 A-70567-0227 15-80-0507
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.49K  /  7 Page

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Amphenol Communications Solutions

Part No. 51760-10401204AALF
Description PwrBlade®, Power Connectors, 4P 12S 4P Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    0015800685 70567-0168 A-70567-0168 15-80-0685

Molex Electronics Ltd.
Part No. 0015800685 70567-0168 A-70567-0168 15-80-0685
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective P
MOLEX Connector

File Size 1,218.47K  /  7 Page

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Amphenol Communications Solutions

Part No. 51701-10001202AALF
Description PwrBlade®, Power Supply Connectors, Vertical Header, With Guide Pin 12S 2P
Tech specs    

Official Product Page

    A-70567-0346 15-80-1161 0015801161

Molex Electronics Ltd.
Part No. A-70567-0346 15-80-1161 0015801161
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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Amphenol Communications Solutions

Part No. 51762-10201200BALF
Description PwrBlade®, Power Connectors, 2P 12S Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    A-70567-0344 15-80-1121 0015801121

Molex Electronics Ltd.
Part No. A-70567-0344 15-80-1121 0015801121
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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Amphenol Communications Solutions

Part No. 51742-11301200AALF
Description PwrBlade®, Power Supply Connectors, 13P 12S Vertical Receptacle.
Tech specs    

Official Product Page

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