6418 pdf Datasheet P6 Part Num --- IC-ON-LINE


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6418 Datasheet PDF File

For 6418 Found Datasheets File :: 98+ Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 |

					Samsung semiconductor
Part No.	K7J643682M07 K7J641882M
Description	2Mx36 & 4Mx18 DDR II SIO b2 SRAM
File Size	429.81K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6418-11H
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Samsung semiconductor
Part No.	K7I643682M07 K7I641882M
Description	2Mx36 & 4Mx18 DDRII CIO b2 SRAM
File Size	413.02K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87606-418LF
Description	Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Hitachi Semiconductor
Part No.	HD64180ZP HD64180RP HD64180RCP HD64180RCP-6X HD64180RP-10 HD64180RP-6 HD64180Z HD64180ZCP-10X HD64180ZCP-6X HD64180ZP-10 HD64180ZP-6 HD64180ZCP HD64180R HD64180RCP-10X HD64180RCP-8X HD64180RF HD64180RF-10X HD64180RF-6X HD64180RF-8X HD64180RP-8 HD64180ZCP-8X HD64180ZF HD64180ZF-10X HD64180ZF-6X HD64180ZF-8X HD64180ZP-8
Description	HD64180R/Z 8-BIT CMOS (Micro Processing Unit)
File Size	6,916.42K / 133 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68466-418HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
Tech specs				Official Product Page

					Hitachi,Ltd. Hitachi Semiconductor
Part No.	HD64180R HD64180RCP-10X HD64180RCP-6X HD64180RCP-8X HD64180RF-6X HD64180RF-8X HD64180RP HD64180RP-10 HD64180RP-6 HD64180RP-8 HD64180Z HD64180RF-10X HD64180ZCP HD64180ZCP-10X HD64180ZCP-6X HD64180ZCP-8X HD64180ZF HD64180ZP-10 HD64180ZP-6 HD64180ZF-10X HD64180ZF-6X HD64180ZF-8X HD64180ZP-8
Description	High-Power, Quad, PSE Controller for Power-Over-Ethernet HD64180R / 8位CMOS（微处理单元 HD64180R/Z 8-BIT CMOS (Micro Processing Unit) HD64180R/Z 8-BIT CMOS (Micro Processing Unit)
File Size	6,955.35K / 133 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68016-418HLF
Description	BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100) Pitch.
Tech specs				Official Product Page

					SAMSUNG[Samsung semiconductor]
Part No.	K7I643682M-FC30 K7I641882M K7I641882M-EI16 K7I641882M-EI20 K7I641882M-EI25 K7I641882M-EI30 K7I641882M-FC16 K7I641882M-FC20 K7I641882M-FC25 K7I641882M-FC30 K7I643682M K7I643682M-EI16 K7I643682M-EI20 K7I643682M-EI25 K7I643682M-EI30 K7I643682M-FC16 K7I643682M-FC20 K7I643682M-FC25
Description	72Mb M-die DDRII SRAM Specification 165 FBGA with Pb & Pb-Free (RoHS compliant)
File Size	301.37K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6418-11D
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					White Electronic Design...
Part No.	W3DG6418V75D2XX
Description	128MB - 16Mx64, SDRAM UNBUFFERED
File Size	124.86K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	91276-418HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor] SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K7R640982M K7R643682M K7R641882M
Description	2Mx36 & 4Mx18 & 8Mx9 QDRTM II b2 SRAM
File Size	362.84K / 19 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	67996-418HLF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch
Tech specs				Official Product Page


Part No.	HD64180SH6 HD64180SH8 HD64180SH10 HD64180SCP10
Description	8-Bit Microprocessor MCU AVR 8K FLASH 15MHZ 20-TSSOP 8位微处理
File Size	327.34K / 12 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	52601-S26-418RLF
Description	Quickie® IDC Cable-to-Board Connector System, Shrouded Vertical Header, Through Hole, Low Profile, Double Row, 25 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K7R643684M07 K7R641884M K7R641884M-FC200 K7R641884M-FI250
Description	2Mx36 & 4Mx18 QDR II b4 SRAM 4M X 18 QDR SRAM, 0.45 ns, PBGA165
File Size	446.19K / 19 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	146-4182-12D
Description	Paladin HD, RAF, 4 Pair, 8 Column, NiS
Tech specs				Official Product Page

					White Electronic Design...
Part No.	W3DG6418V75D1 W3DG6418V75JD1
Description	128MB - 16Mx64 SDRAM UNBUFFERED
File Size	133.27K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87916-418HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs				Official Product Page

For 6418 Found Datasheets File :: 98+ Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 |

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