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  43045-2419 Datasheet PDF File

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    43045-1818

Molex Electronics Ltd.
Part No. 43045-1818
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.78K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-1813

Molex Electronics Ltd.
Part No. 43045-1813
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits
File Size 166.55K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-1817

Molex Electronics Ltd.
Part No. 43045-1817
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits
File Size 174.07K  /  3 Page

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Amphenol Communications Solutions
Part No. 68002-419HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1811

Molex Electronics Ltd.
Part No. 43045-1811
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 180.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-124-19LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1816

Molex Electronics Ltd.
Part No. 43045-1816
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits
File Size 174.08K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-424-19LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1819

Molex Electronics Ltd.
Part No. 43045-1819
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.82K  /  3 Page

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Amphenol Communications Solutions
Part No. 68422-419HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
Tech specs 　 　

Official Product Page

    43045-1815

Molex Electronics Ltd.
Part No. 43045-1815
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits
File Size 174.05K  /  3 Page

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Amphenol Communications Solutions
Part No. 93992-419HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1800

Molex Electronics Ltd.
Part No. 43045-1800
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits
File Size 190.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-124-19LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    43045-0600

Molex Electronics Ltd.
Part No. 43045-0600
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits
File Size 190.59K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-424-19LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    43045-1820

Molex Electronics Ltd.
Part No. 43045-1820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.82K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-419221150LF
Description BergStik®, Board to Board connector, Unshrouded Stacking vertical header, Through Hole, Double Row, 22 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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