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  43045-0817 Datasheet PDF File

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    43045-1816

Molex Electronics Ltd.
Part No. 43045-1816
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits
File Size 174.08K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-1819

Molex Electronics Ltd.
Part No. 43045-1819
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.82K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-1815

Molex Electronics Ltd.
Part No. 43045-1815
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits
File Size 174.05K  /  3 Page

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Amphenol Communications Solutions
Part No. 57102-S08-17LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions
Tech specs 　 　

Official Product Page

    43045-1814

Molex Electronics Ltd.
Part No. 43045-1814
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits
File Size 166.55K  /  3 Page

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Amphenol Communications Solutions
Part No. 57102-F08-17LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 34 Positions - 2mm (0.079inch) - Vertical
Tech specs 　 　

Official Product Page

    43045-0610

Molex Electronics Ltd.
Part No. 43045-0610
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 6 Circuits
File Size 180.50K  /  3 Page

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Amphenol Communications Solutions
Part No. 108-1711-100
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, Guide Module, With Post, No Key.
Tech specs 　 　

Official Product Page

    43045-0822

Molex Electronics Ltd.
Part No. 43045-0822
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 183.86K  /  3 Page

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Amphenol Communications Solutions
Part No. 59202-F40-08-174LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs 　 　

Official Product Page

    43045-0410

Molex Electronics Ltd.
Part No. 43045-0410
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 4 Circuits
File Size 180.68K  /  3 Page

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Amphenol Communications Solutions
Part No. 54101-G0817LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0800

Molex Electronics Ltd.
Part No. 43045-0800
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits
File Size 190.59K  /  3 Page

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Amphenol Communications Solutions
Part No. 54201-G0817LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-0802

Molex Electronics Ltd.
Part No. 43045-0802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 54102-T0817LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 34 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    43045-0806

Molex Electronics Ltd.
Part No. 43045-0806
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 184.20K  /  3 Page

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Amphenol Communications Solutions
Part No. 54122-111081700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

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