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HGABNDA 60N10S MM1562G 2N4238 ST8024CD 44137 0805KRCT MC68B01
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  PAI-1801 Datasheet PDF File

For PAI-1801 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Intersil
Part No. ISL1801
Description sPMIC for Micro-Converter Bias and Drivers

File Size 1,060.23K  /  30 Page

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Amphenol Communications Solutions

Part No. 98401-801-28LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    General Cable Technolog...
Part No. C118011
Description 1C 9.5 SOLID BCCS PE FILAMENT AIRCORE OAS PVC

File Size 26.12K  /  1 Page

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Amphenol Communications Solutions

Part No. 98401-801A34LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. PCM1801
Description From old datasheet system

File Size 97.93K  /  13 Page

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Amphenol Communications Solutions

Part No. 98401-801-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    18014RC

Aries Electronics, Inc.
Part No. 18014RC
Description Series 652000 and 653000 RoHs/WEEE-Compliant PLCC-to-DIP Adapter

File Size 293.75K  /  1 Page

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Amphenol Communications Solutions

Part No. 98401-801-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    NTE[NTE Electronics]
Part No. NTE1801
Description Integrated Circuit TV dbx Noise Reduction System

File Size 21.87K  /  3 Page

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Amphenol Communications Solutions

Part No. 87180-184C
Description Modular Jack, CAT 3, Low Profile, 8P4C, Right Angle, Through Mount, Without Shield, Snap Peg, 1 Port
Tech specs    

Official Product Page

    18013RC

Aries Electronics, Inc.
Part No. 18013RC
Description RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter

File Size 294.43K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-801-02LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 02 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    Macroblock
Part No. MBI1801
Description High Power LED Driver

File Size 301.45K  /  13 Page

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Amphenol Communications Solutions

Part No. 77311-801-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    BGF1801-10

NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
Part No. BGF1801-10
Description GSM1800 EDGE power module 1805 MHz - 1880 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER

File Size 89.63K  /  11 Page

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Amphenol Communications Solutions

Part No. 77311-801-35LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    ALD
Part No. ALD1801
Description 8 BIT MICROPOWER MULTIPLYING D/A CONVERTER

File Size 40.13K  /  7 Page

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Amphenol Communications Solutions

Part No. 77311-801-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 06 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

   
Part No. 9251801
Description DRUCKSENSOR

File Size 169.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-801-30LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For PAI-1801 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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