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  94213-9014 Datasheet PDF File

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    90143-0014

Molex Electronics Ltd.
Part No. 90143-0014
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 14 Circuits

File Size 250.10K  /  2 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. XPN19014MC
Description P-ch MOSFET, -40 V, -20 A, 0.0187 Ω@-10 V, TSON Advance(WF), AEC-Q101
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90143-0028

Molex Electronics Ltd.
Part No. 90143-0028
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 28 Circuits

File Size 250.36K  /  2 Page

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Amphenol Communications Solutions

Part No. 51939-014LF
Description PwrBlade®, Power Connectors, 3P 24S 4P Right Angle Header, Solder To Board
Tech specs    

Official Product Page

    90143-0026

Molex Electronics Ltd.
Part No. 90143-0026
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 26 Circuits

File Size 250.36K  /  2 Page

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Amphenol Communications Solutions

Part No. 68690-140HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90143-0036

Molex Electronics Ltd.
Part No. 90143-0036
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 36 Circuits

File Size 250.24K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-412HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90143-0040

Molex Electronics Ltd.
Part No. 90143-0040
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 40 Circuits

File Size 250.24K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90143-0050

Molex Electronics Ltd.
Part No. 90143-0050
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 50 Circuits

File Size 250.24K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-456HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 56 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90143-0056

Molex Electronics Ltd.
Part No. 90143-0056
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 56 Circuits

File Size 250.36K  /  2 Page

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Amphenol Communications Solutions

Part No. 10136290-141PLF
Description Minitek<sup>reg;</sup> Pwr 4.2 High Current Connector, Wire to Board connector, Plug Terminal, Right Angle , 4.20mm (0.165in) Pitch.
Tech specs    

Official Product Page

    90143-0060

Molex Electronics Ltd.
Part No. 90143-0060
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 60 Circuits

File Size 250.24K  /  2 Page

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Amphenol Communications Solutions

Part No. 67289-014
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 28 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs    

Official Product Page

    90143-0064

Molex Electronics Ltd.
Part No. 90143-0064
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 64 Circuits

File Size 250.24K  /  2 Page

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Amphenol Communications Solutions

Part No. 68690-148HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90147-1207

Molex Electronics Ltd.
Part No. 90147-1207
Description 2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 7 Circuits

File Size 169.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 87901-420HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

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