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  89761-6810 Datasheet PDF File

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    468106 BNX022-01 BNX023-01

Murata Manufacturing Co., Ltd.
Murata Manufacturing Co...
Part No. 468106 BNX022-01 BNX023-01
Description Block Type EMIFIL (LC Combined) SMD Type
File Size 44.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 68105-001LF
Description PV® Wire-to-Board Connector System, Mini Latch Housing, Double Row, 2.54mm (0.100in), 4 Positions..
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    CBCX68 CBCX6810 CBCX69

Central Semiconductor Corp
Part No. CBCX68 CBCX6810 CBCX69
Description SURFACE MOUNT COMPLEMENTARY SILICON SMALL SIGNAL TRANSISTORS
File Size 279.28K  /  2 Page

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Amphenol Communications Solutions
Part No. 68105-002LF
Description PV® Wire-to-Board Connector System, Mini Latch Housing, Double Row, 2.54mm (0.100in), 6 Positions..
Tech specs 　 　

Official Product Page

    W6810 W6810IE W6810IR W6810IS

Winbond
Part No. W6810 W6810IE W6810IR W6810IS
Description SINGLE-CHANNEL VOICEBAND CODEC
File Size 400.87K  /  36 Page

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Amphenol Communications Solutions
Part No. 68105-003LF
Description PV® Wire-to-Board Connector System, Mini Latch Housing, Double Row, 2.54mm (0.100in), 8 Positions..
Tech specs 　 　

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    A6810EA A6810EEP

Allegro MicroSystems
Part No. A6810EA A6810EEP
Description DABiC-IV 10-Bit Serial-Input Latched Source Drivers with Active Pull-Downs
File Size 119.98K  /  9 Page

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Amphenol Communications Solutions
Part No. 75168-101-10LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    Samsung
Part No. KM681000B
Description 128K x8 bit Low Power CMOS Static RAM
From old datasheet system
File Size 194.14K  /  10 Page

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Amphenol Communications Solutions
Part No. 10114868-10J-10DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs 　 　

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    Hyundai
Part No. HYM536810
Description 8M x 36-Bit CMOS DRAM Module
File Size 641.38K  /  14 Page

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Amphenol Communications Solutions
Part No. 75168-102-08LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 08 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    2SC468105

Toshiba Semiconductor
Part No. 2SC468105
Description Strobe Flash Applications Medium Power Amplifier Applications
File Size 112.66K  /  3 Page

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Amphenol Communications Solutions
Part No. 75168-102-02LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 02 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    2SA168107 2SA1681

Toshiba Semiconductor
Part No. 2SA168107 2SA1681
Description Power Amplifier Applications Power Switching Applications
File Size 157.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 75168-101-13LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 13 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    2SK306810

Toshiba Semiconductor
Part No. 2SK306810
Description Chopper Regulator DC−DC Converter, and Motor Drive Applications
File Size 439.73K  /  6 Page

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Amphenol Communications Solutions
Part No. 51968-10012800AALF
Description PwrBlade®, Power Connectors, 128S Right Angle Receptacle, Solder To Board
Tech specs 　 　

Official Product Page

    KM681001B KM681001B-15 KM681001B-20

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. KM681001B KM681001B-15 KM681001B-20
Description From old datasheet system
128Kx8 Bit High Speed Static RAM(5V Operating), Evolutionary Pin out.
128K x 8 Bit High-Speed CMOS Static RAM
File Size 180.26K  /  9 Page

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Amphenol Communications Solutions
Part No. 75168-101-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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