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  87759-4051 Datasheet PDF File

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    87759-3875

Molex Electronics Ltd.
Part No. 87759-3875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs,

File Size 280.29K  /  6 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 74HC4051FT
Description CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-0464

Molex Electronics Ltd.
Part No. 87759-0464
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 4 Circuits

File Size 421.14K  /  8 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 74VHC4051AFT
Description CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC, AEC-Q100
Tech specs    

Official Product Page

    87759-0465

Molex Electronics Ltd.
Part No. 87759-0465
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging

File Size 280.44K  /  6 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 74HC4051D
Description CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, SOIC16, -40 to 125 degC
Tech specs    

Official Product Page

    87759-0674

Molex Electronics Ltd.
Part No. 87759-0674
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 6 Circuits, 0.38um (15u) Gold (Au) Selective Plating

File Size 421.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 10136654-0511LF
Description Minitek® Pwr 3.0, Single Row, Right Angle Through Hole Header, Tin plating, 5 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    87759-0814

Molex Electronics Ltd.
Part No. 87759-0814
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.16K  /  8 Page

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Amphenol Communications Solutions

Part No. G832MB010405122HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold Black.
Tech specs    

Official Product Page

    87759-0815

Molex Electronics Ltd.
Part No. 87759-0815
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 8 Circuits

File Size 279.45K  /  6 Page

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Amphenol Communications Solutions

Part No. 68405-130HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87759-4014

Molex Electronics Ltd.
Part No. 87759-4014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 563.47K  /  11 Page

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Amphenol Communications Solutions

Part No. 68405-172
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87759-1874

Molex Electronics Ltd.
Part No. 87759-1874
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 68405-140HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87759-0874

Molex Electronics Ltd.
Part No. 87759-0874
Description 2.00mm (.079 (15μ Cap, Tape and Reel Packaging, Lead-free

File Size 421.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 68405-154HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 54 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87759-0875

Molex Electronics Ltd.
Part No. 87759-0875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.47K  /  6 Page

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Amphenol Communications Solutions

Part No. 10128405-101LF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 2-Pair LP, 10 column, 80 position, Right Angle Header, No Guide Pin.
Tech specs    

Official Product Page

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