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  76155-0114 Datasheet PDF File

For 76155-0114 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    11-40-2015 1140-2015 0011-40-2015 001140-2015

Molex Electronics Ltd.
Part No. 11-40-2015 1140-2015 0011-40-2015 001140-2015
Description Terminator Die

File Size 19.96K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SW65-0114-TB SW65-0114TR SW65-0114

Tyco Electronics
Part No. SW65-0114-TB SW65-0114TR SW65-0114
Description 吸收砷化镓单刀双掷开关与ASIC驱动器,直流- 3.0吉赫
GaAs SPDT Absorptive Switch with ASIC Driver, DC - 3.0 GHz

File Size 210.95K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0011-40-4205 1140-4205 001140-4205

Molex Electronics Ltd.
Part No. 0011-40-4205 1140-4205 001140-4205
Description Insulation Anvil

File Size 16.13K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    11-40-4409 0011-40-4409 1140-4409 001140-4409

Molex Electronics Ltd.
Part No. 11-40-4409 0011-40-4409 1140-4409 001140-4409
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    022-55-2323 70450-0114

Molex Electronics Ltd.
Part No. 022-55-2323 70450-0114
Description 2.54mm (.100) Pitch SL Crimp Housing, Dual Row, Version C, Back Ribs, 32 Circuits
2.54mm (.100) Pitch SL?/a> Crimp Housing, Dual Row, Version C, Back Ribs, 32 Circuits
2.54mm (.100") Pitch SL垄芒 Crimp Housing, Dual Row, Version C, Back Ribs, 32 Circuits

File Size 114.57K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    001140-4323 0011-40-4323

Molex Electronics Ltd.
Part No. 001140-4323 0011-40-4323
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    SW65-0114 SW65-0114-TB SW65-0114TR

M/A-COM Technology Solutions, Inc.
Part No. SW65-0114 SW65-0114-TB SW65-0114TR
Description GaAs SPDT Absorptive Switch with ASIC Driver, DC-3.0 GHz

File Size 106.74K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    1140-4200 0011-40-4200 001140-4200

Molex Electronics Ltd.
Part No. 1140-4200 0011-40-4200 001140-4200
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    001140-2193 0011-40-2193

Molex Electronics Ltd.
Part No. 001140-2193 0011-40-2193
Description Terminator Die

File Size 20.08K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

    0011-40-2192 1140-2192 001140-2192

Molex Electronics Ltd.
Part No. 0011-40-2192 1140-2192 001140-2192
Description Terminator Die

File Size 19.91K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114868-10J-10DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs    

Official Product Page

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