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  75341-4644 Datasheet PDF File

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    75341-7744

Molex Electronics Ltd.
Part No. 75341-7744
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX庐 Backplane Connector System, Power Module, 12 Circuits, 1.27渭m (50渭) Gold (Au)
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System, Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au)

File Size 303.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 68464-408HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75341-6466

Molex Electronics Ltd.
Part No. 75341-6466
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System, Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au)

File Size 303.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 68464-432HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75341-6646

Molex Electronics Ltd.
Part No. 75341-6646
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System, Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au)

File Size 303.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 68464-454HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 54 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75341-6647

Molex Electronics Ltd.
Part No. 75341-6647
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System, Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au)

File Size 303.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 10135584-644402LF
Description Bergstak® 0.80mm Pitch, Board to Board Vertical Header, Dual Row, 64 Positions, 0.80mm (0.031in) Pitch.
Tech specs    

Official Product Page

    75341-6464

Molex Electronics Ltd.
Part No. 75341-6464
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System, Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au)
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX垄莽 Backplane Connector System, Power Module, 12 Circuits, 1.27楼矛m (50楼矛) Gold (Au)

File Size 303.65K  /  6 Page

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Amphenol Communications Solutions

Part No. 68464-418HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75341-7676

Molex Electronics Ltd.
Part No. 75341-7676
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX Backplane Connector System, Power Module

File Size 303.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 68464-440HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75341-7677

Molex Electronics Ltd.
Part No. 75341-7677
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System, Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au)

File Size 303.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 68464-462HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. AAT4644
Description From old datasheet system

File Size 192.25K  /  8 Page

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Amphenol Communications Solutions

Part No. 94644-124
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    2SC4644

SANYO[Sanyo Semicon Device]
Part No. 2SC4644
Description High Voltage Driver Applications

File Size 102.31K  /  3 Page

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Amphenol Communications Solutions

Part No. 68464-422HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 22 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Sanyo
Part No. 2SC4644
Description NPN Triple Diffused Planar Silicon Transistor

File Size 122.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 68464-442HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

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