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  74058-8501 Datasheet PDF File

For 74058-8501 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    85015-0206

Molex Electronics Ltd.
Part No. 85015-0206
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, 4-Row, Style R Male

File Size 61.92K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-501-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    85013-3160

Molex Electronics Ltd.
Part No. 85013-3160
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 32 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 32 Circuits, Lead free

File Size 124.34K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-46LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85013-9028

Molex Electronics Ltd.
Part No. 85013-9028
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, 3-Row C-Pin, Style R Male

File Size 74.09K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-501A16LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85013-3304

Molex Electronics Ltd.
Part No. 85013-3304
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1um (40u) Selective Gold (Au)
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1um (40u") Selective Gold (Au)

File Size 68.76K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-501A40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85013-3201

Molex Electronics Ltd.
Part No. 85013-3201
Description 2.54mm (.100) Pitch DIN 41612 Header, Style R/2 Reverse, 32 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Style R/2 Reverse, 32 Circuits

File Size 144.75K  /  6 Page

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Amphenol Communications Solutions

Part No. 95278-501B20LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    76135-8501

Molex Electronics Ltd.
Part No. 76135-8501
Description 2.00mm (.079) Pitch VHDM? H Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin, Signal End Module, Open End Version, 200 Circuits

File Size 403.73K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-501B40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85015-0141

Molex Electronics Ltd.
Part No. 85015-0141
Description 2.54mm (.100) Pitch DIN 41612 Header, 4-Row C-Pin, Press-Fit Style R Reverse, Vertical, Through Hole, 0.6μm (24μ) Gold (Au), 128 Circuits, Lead free

File Size 69.39K  /  3 Page

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Amphenol Communications Solutions

Part No. RJCSE508501
Description Modular Jack - Right Angle, Input Output Connectors 8P8C, Without Shield, With LEDs.
Tech specs    

Official Product Page

    85015-9008

Molex Electronics Ltd.
Part No. 85015-9008
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R, 0.6渭m (24渭) Selective Gold (Au), 128 Circuits, Lead Free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R, 0.6μm (24μ) Selective Gold (Au), 128 Circuits, Lead Free

File Size 167.63K  /  5 Page

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Amphenol Communications Solutions

Part No. 468-5010-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row HSD, 10 positions, open, 4.75mm (0.187in), Header.
Tech specs    

Official Product Page

    76136-8501

Molex Electronics Ltd.
Part No. 76136-8501
Description 2.00mm (.079) Pitch VHDM H Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin
2.00mm (.079") Pitch VHDM H Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin

File Size 428.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 498-5010-A62
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row VHDM, 10 positions, right, A-Key, 6.25mm (0.246in), Header.
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 85013-1914
Description DINCONN. R MALE 64CKT 850131914 64 CONTACT(S), MALE, STRAIGHT TWO PART EURO CONNECTOR, SOLDER

File Size 125.89K  /  3 Page

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Amphenol Communications Solutions

Part No. 498-5010-C64
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row VHDM, 10 positions, right, C-Key, 5.15mm (0.202in), Header.
Tech specs    

Official Product Page

For 74058-8501 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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