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  73780-2165 Datasheet PDF File

For 73780-2165 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    73780-3153

Molex Electronics Ltd.
Part No. 73780-3153
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 13.00mm (.512), Pin Length 3.50mm (.138),
2.00mm (.079") Pitch HDM垄莽 Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 13.00mm (.512"), Pin Length 3.50mm (.138

File Size 198.98K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-109721650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    73780-2167

Molex Electronics Ltd.
Part No. 73780-2167
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits

File Size 194.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 88952-165LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Wide body.
Tech specs    

Official Product Page

    73780-3163

Molex Electronics Ltd.
Part No. 73780-3163
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits

File Size 198.71K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-109121650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73780-0257

Molex Electronics Ltd.
Part No. 73780-0257
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.50mm (.138),

File Size 202.04K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-110721650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    73780-0247

Molex Electronics Ltd.
Part No. 73780-0247
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits

File Size 202.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-809121650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73780-0236

Molex Electronics Ltd.
Part No. 73780-0236
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits

File Size 202.01K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-809121650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    73780-2257

Molex Electronics Ltd.
Part No. 73780-2257
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.50mm (.138),

File Size 198.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-108021650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73780-3156 SD-73780-001

Molex Electronics Ltd.
Part No. 73780-3156 SD-73780-001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle
2.00mm (.079") Pitch HDM庐 Board-to-Board Daughtercard Receptacle
2.00mm (.079") Pitch HDM垄莽 Board-to-Board Daughtercard Receptacle

File Size 194.15K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-109221650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 22 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Laird Tech Smart Techno...
Part No. Y2165
Description All UHF and higher frequency models are delivered fully assembled.

File Size 250.31K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-810121650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Maxim Integrated Products, Inc.
Part No. DS2165
Description 16/24/32kbps ADPCM处理 A/MU-LAW, ADPCM CODEC, PDIP24

File Size 316.94K  /  18 Page

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Amphenol Communications Solutions

Part No. 54122-109121650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 73780-2165 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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