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  70543-0023 Datasheet PDF File

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    0705430112

Molex Electronics Ltd.
Part No. 0705430112
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 8Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0705430114

Molex Electronics Ltd.
Part No. 0705430114
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 10 Circuits, 0.76um
File Size 418.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430117

Molex Electronics Ltd.
Part No. 0705430117
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 13Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-435HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430118

Molex Electronics Ltd.
Part No. 0705430118
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-432HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430115

Molex Electronics Ltd.
Part No. 0705430115
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 11Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 94937-0543LF
Description Header, Top Mount, Upper Deck(68Pins), 5V, 4.3mm s/o
Tech specs 　 　

Official Product Page

    0705430116

Molex Electronics Ltd.
Part No. 0705430116
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 12Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-431HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430129

Molex Electronics Ltd.
Part No. 0705430129
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 25 Circuits, 0.76um (30u)
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 61127-0543LF
Description Header, Top Mount, Upper Deck(68Pins), VTB, 3.3V, 4.3mm s/o
Tech specs 　 　

Official Product Page

    0705430128

Molex Electronics Ltd.
Part No. 0705430128
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 24 Circuits, 0.76um
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-434HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0705430127

Molex Electronics Ltd.
Part No. 0705430127
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 23Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. SE1820023111111
Description Slim Cool Edge 0.65mm, Surface mount, 8 power pins, 200 signal pins, Vertical
Tech specs 　 　

Official Product Page

    0705430126

Molex Electronics Ltd.
Part No. 0705430126
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 22Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 418.15K  /  4 Page

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Amphenol Communications Solutions
Part No. 68000-232HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

For 70543-0023 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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