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Molex Electronics Ltd.
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| Part No. |
0702462004 70246-2004
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating
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| File Size |
176.00K /
4 Page |
 View
it Online |
Download Datasheet
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TLP3483
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| Description |
Photorelay (MOSFET output, 1-form-a), 200 V/0.35 A, 500 Vrms, P-SON4
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70246-2604 0702462604
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.127渭m (5渭) Gold (Au) Plating, Tin(Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating
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| File Size |
176.00K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
70246-001LF
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| Description |
Metral® Accessories, Backplane Connectors, Hybrid Cable Connector Cover, 6 Position, LF.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70246-2601 0702462601
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
175.77K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-483-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row, 16 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70246-2501 0702462501
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating,
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, Void
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| File Size |
175.78K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJE1R288323483
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| Description |
Modular Jacks, Input Output Connectors, 8P8C, Cat6 over Cat5e, Stacked, Shield, With LEDs
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70246-2401 0702462401
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| Description |
2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 24 Circuits, 0.38um (15u") Gold (Au)
2.54mm (.100) Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 24 Circuits, 0.38um (15u) Gold (Au)
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| File Size |
175.72K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
73348-301LF
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| Description |
DUFLEX CONTACT
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70246-3404 0702463404
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating
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| File Size |
176.00K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJE1R288333483
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| Description |
Modular Jacks, Input Output Connectors, 8P8C, Cat6, Stacked, Shield, With LEDs
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70246-3402 0702463402
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
175.78K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJE1R288233483
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| Description |
Modular Jacks, Input Output Connectors, 8P8C, Cat5e over Cat6, Stacked, Shield, With LEDs
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70246-3401 0702463401
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
175.77K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
134-8324-21H
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| Description |
Paladin, 8-Pair, 4 Column, Left End Wall, Right Angle Header, 2.5mm Wipe, APP
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
134-8324-21D
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| Description |
Paladin, 8-Pair, 4 Column, Left End Wall, Right Angle Header, 2.5mm Wipe, NiS
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
134-8328-21H
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| Description |
Paladin, 8-Pair, 8 Column, Left End Wall, Right Angle Header, 2.5mm Wipe, APP
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| Tech specs |
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Official Product Page
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Price and Availability
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