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  66056-011 Datasheet PDF File

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    21-0111

Maxim Integrated Products
Part No. 21-0111
Description PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD

File Size 25.47K  /  1 Page

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HUA FENG CIRCUIT





    HG-0113

List of Unclassifed Manufacturers
ETC[ETC]
Part No. HG-0113
Description Shipped in packet-tape reel(5,000pcs per reel)

File Size 99.64K  /  2 Page

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    22-28-0111

Molex Electronics Ltd.
Part No. 22-28-0111
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 11 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 55.32K  /  5 Page

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    21-0110

Dallas Semiconducotr
DALLAS[Dallas Semiconductor]
Part No. 21-0110
Description PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm

File Size 50.78K  /  2 Page

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    Mill-Max
Part No. 5011-0-00-01-00-00-03-0
Description Double Tail Header Pin

File Size 83.98K  /  1 Page

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    Asahi Kasei Microsystem...
Part No. HG-0115
Description    Shipped in packet-tape reel(5,000pcs per reel)

File Size 123.52K  /  3 Page

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    Molex, Inc.
Part No. 08-50-0113
Description Crimp Socket Contact; Wire Size (AWG):30-22; Contact Plating:Tin; Series:2759; Lead Pitch:2.54mm; Reel Quantity:10000; Voltage Rating:250V BRASS, TIN OVER NICKEL FINISH, WIRE TERMINAL

File Size 144.65K  /  2 Page

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    Asahi Kasei Microsystem...
Part No. HG-0113
Description    Shipped in packet-tape reel(5,000pcs per reel)

File Size 170.78K  /  3 Page

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    03-09-2011

Molex Electronics Ltd.
Part No. 03-09-2011
Description THIS HOUSING IS FOR USE WITH THE .093 DIA. TERMININALS

File Size 34.12K  /  1 Page

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    7011

ASM GmbH
Part No. 7011
Description DC SIGNAL SOURCE

File Size 1,539.28K  /  4 Page

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